ラッピング定盤

LAPPING PLATEN

Dedicated factory delivers stable quality

In addition to the miroku machinery's original technology has been accumulated by continuous metal processing, we realized high quality lapping meets customer's needs. We use carefully selected materials uniformly structured from the surface to the inside.

Both sides lapping plate

Product features

Spherical graphite is uniformly distributed from the surface to the deep part, the holding force of abrasive grain is maintained to the end and High productivity and accuracy can be obtained.

Model name Surface hardness
HRc
Graphite form Use example
Grain shape Grain diameter μm Number of grain b/mm2
M-400 18~25 Spherical 20~50 180~220 Crystal
Glass etc
M-450 24~30 Spherical 20~50 180~220 Silicon wafer
Photo mask
Ceramic
Mirrot of copier
Crystal
Glass etc
M-600 30~36 Spherical 20~50 180~220 Compound semiconductor
Metals
Oxide wafer etc
M-700 34~40 Spherical 20~50 150~220 Silicon wafer
Ceramic
Carbon
Metals etc
M-800 38~45 Spherical 20~50 150~220 Silicon wafer
Ceramic
Carbon
Metals etc
M-900 43~50 Spherical 20~50 150~220 Silicon wafer
Ceramic
Carbon
Metals etc

Consultation is available at any time for special products.
Up to Φ2200mm is possible we can accept.

Single-sided lapping plate
(segment)

Product features

By using a special alloy is uniformly distributed in hardness from the surface to the deep part, high hardness is ensured up to the central part. Efficient and accurate machining is possible to the end.

Other related consumables
We handle various consumables related to wrapping.

  • Double-sided correction carrier

  • Carrier materials
    EG, SK, SUS BAKE

  • All kinds of
    lapping powder

  • Miroku Machine Tool Inc.

    Miroku Machine Tool Inc.

    CONTACT

    Tokyo Sales Office

    TEL

    +81 47 355 5505

    Osaka Sales Office

    TEL

    +81 6 6430 1288

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